The 2015 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT2015) will be held at the Sakura-hall Tohoku University, Sendai, Japan, on August 26-28, 2015.
This conference is organized and sponsored by the IEEE MTT-S, and will be supported by IEEE MTT-S Japan / Kansai / Nagoya Chapters. The Institute of Electronics Information and Communication Engineers (IEICE) Electronic Society is a Technical Co-Sponsor of the RFIT.
The topics include, but are not limited to, the following technical areas :
1. High-number Spec ICs:
High speed/high frequency/high bandwidth/high integration/high performance circuits and systems.
2. Low-number Spec ICs:
Low power/low voltage/low noise/low complexity circuits and systems.
3. 3D integrations and Packaging technology:
On-chip antenna, integrated passive devices, MCM, SiP, TSV, MEMS, Flip chip assembly, Wire bonding, etc.
4. Frequency Generation ICs:
VCOs, PLLs, synthesizers, ADPLL, DDS, frequency dividers, multipliers, etc.
5. Building Block RFICs:
LNA, PA, mixers, RFFE, Si-based MMIC, etc.
6. Analog and Mixed Signal ICs:
Amplifiers, ADC, DAC, comparators, filters, AGC/VGA, etc.
7. Device Technologies:
Active/passive devices, packaging, CMOS, SOI, SiGe, GaAs, LDMOS, GaN, reliability, characterization, CAD, modeling, EM simulation, co-simulation, etc.
8. New Energy IC:
Power management, data converters, sensor and DSP interface IC, new energy vehicle electronics EM and ICs, etc.
RFIDs, Electric Coupling, Electromagnetic induction, Magnetic resonance, Wireless power transmission, etc.
10. Meta-material circuits and devices:
Hybrid semiconductor, etc.
11. Body Area Network:
Communication, Security, biological information monitor, Health care, etc.